Technical Capacity

ITEMCapability
Month Capability1000types/month,8,000sqm/month
Board MaterialStandard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 
Surface treatmentOSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin, Immersion silver, Plating hard gold, Gold fingers,Flash gold, ENEPIG 
ToleranceBoard thickness tolerance 1.0mm: +/-0.1mm 1.0mm-2.0mm: +/-10% >2.0mm: +/-8% 
Hole diameter tolerance PTH: +/-0.075mm NPTH:+/-0.05mm
Hole location tolerance: +/-0.075mm
Outline tolerance: < 100mm: +/-0.1mm 100mm-300mm: +/-0.15mm >300mm: +/-0.2mm
Technical SpecificationLayers: 1-24 layers
Min line width/space: 0.075/0.075mm
Min hole: 0.15mm (mechanical drilling) 0.1mm (laser drilling)
Min pad ring: 0.1mm
Max copper thickness: 12oz
Max board size:1-2 layers: 635 X 1100mm Multilayers: 500 X 1100mm
Board thickness: 2-layers: 0.2-7.0mm Multi-layers: 0.4-7.0mm Inner layers: 0.1mm
Board warpage: ≤1°
Min solder mask bridge: 0.08mm
Aspect Ration: 8:1
Plugging Vias capability: 0.2-0.8mm
Au, Ni thickness control: 1. Chem gold: Au:1-10u” 2. Gold fingers: Au:1-150u” 3. Flash gold: Au:1-10u” 4. Hard gold:Au:1-150u” 5. Ni thickness:50-1000u” 6. ENEPIG: Au:1-8u”,Pd:2-5u

Production Equipment

  • Auto Cutting Machine

    Auto Cutting Machine

  • Drilling Machine

    Drilling Machine

  • CNC Routing Machine

    CNC Routing Machine

  • Pressing

    Pressing

  • X-ray Machine

    X-ray Machine

  • Plating Line

    Plating Line

  • Etching Line

    Etching Line

  • AOI Scanning

    AOI Scanning

  • AOI Inspection

    AOI Inspection

  • Silkscreen

    Silkscreen

  • Dust-free Room

    Dust-free Room

  • Auto Film Exposure

    Auto Film Exposure

  • Auto Gold Immersion Line

    Auto Gold Immersion Line

  • Waste Handling 1

    Waste Handling 1

  • Waste Handling 2

    Waste Handling 2

  • E-test(E-fixture Test)

    E-test(E-fixture Test)

  • Flying Probe Test

    Flying Probe Test

  • Flying Probe Test(High Speed)

    Flying Probe Test(High Speed)

Process

  • Start
  • Incoming
    Inspection
  • Cutting
  • Multi-layer boards
  • 2-layer boards
  • Inner image
    transfer
  • Drilling Hole
  • Etching
  • PTH
  • panel Plating
  • AOI
  • Out-layer image transfer
  • Inner Brown
    oxide
  •       QC
    Inspection
  • pressing
  • pattern
    plating
  • Flash
    Gold
  • Etching
  • QC Inspection
  • W/F
  • QC
    Inspection
  • C/M
  • HAL
  • Immer-sion
    Gold
  • OPS Flash Good/
    Immersion Tin, silver/osp
  •      QC
    Inspection
  • Punching&
    Routing
  • V-CUT
    v-cutting
  • E-TEST
  • FQC
  • OSP
  • Immersion
    Tin silver
  • HAL/Flash Gold
    Immersion Gold
  • FQA
  • FQA
  • Packing
  • Storage
  • Shipment

PCB + Assembly

More and more of our existing PCB customers are now asking us for fully Assembled Printed Circuit Boards delivered to their door to take away all the time consuming stress of component procurement and assembly. In order to meet customers’ requirements, Sunthone develops from a PCB manufacturer to a one-stop PCBA service provider, including PCB assembly, components sourcing, stencils, cable assembly and final product assembly and testing.

Who we are?

PCB Manufacturer

Sunthone, firstly established as a PCB manufacturer, has its own PCB factory with advanced manufacturing facilities, capable in fabricating up to 24 layers PCB boards. The factory is ISO9001 certified, with its PCB products UL approved and RoHS compliant. Your PCB cost and lead time can be reduced to buy PCBs from us.

Flexibility

Sunthone is highly customer oriented catering for customer’s specific requirements. There are various kinds of available services, you can choose either full turn-key solutions or any single specific service. We can handle any size project from minimum quantity one piece to mass production. And we provide quick turn PCB and PCBA manufacturing service.

Quality

Sunthone fully understands the importance of quality for your projects. The quality control system is integrated in each step from preliminary PCB manufacturing to final PCBA packing, and a well-organized inspection and test procedure is performed to ensure the superior quality. All the products are 100% inspected for each shipment.

Available Services

  • PCB Manufacturing
  • PCB Assembly
  • Components Sourcing
  • SMT Stencils
  • Cable Assembly
  • PCBA Testing
  • Final Product Assembly

Assembly Technologces

  • SMT
  • THT
  • Reflow Soldering
  • Wave Soldering
  • Hand Soldering
  • Repair/Rework
  • Mixed Assembly Technologies

Why choose us?

Simplify Your Job

As a one-stop manufacturing service provider, we manage your project from start to finish. Have you ever imagined, that a design files in and a product out? This is what we do. The only thing you have to concern is your product design, PCB gerber data and BOM, and then we produce PCB boards and stencils according to your gerber data, source components and assembly according to your BOM.

Focus on Your Strength

Your cooperation with Sunthone allows you to focus on what you do best, and we can help you to take care of the rest from PCB manufacturing to final product assembly, no matter your core business is research, development, innovation or commercial marketing. We have experienced teams to control all manufacturing processes, and organize different processes in a time and cost efficient flow.

Improve Your Efficiency

Sunthone sources and stocks many kinds of components for clients at a low cost. It is not an easy job for clients to source so many different kinds of components even for a single project, and have to manage thousands of components in stock. We have a team of professionals to source components both in small quantities for sample building and large quantity for mass production.

PCB Assembly Procedures

Name:Endless  Title:Product Development Engineer
Responsible for new electronic products design & development and technical support.
1, With 10years working experience in electronic circuit design, and 6years working experience in electronic products manufacturing with proficiency in more than 10 kinds of manufacturing equipments.
2, Join in the R & D team successfully developed hundreds of smart & automatic & remote controlled products, like APP controlled smart heater, automatic lifting bed, and remote controlled lights.
3, Proficient in the circuit and application of IoT, WiFi modules, GSM/LTE modules, GPS modules, Bluetooth modules.
4, Skilled in using more than 10 kinds of electronic manufacturing equipments, like re-flow oven, lead wire cutter, parts loader, automatic soldering machine, and so on.
Name:Giles  Title:Product Manager
Responsible for products design & development, quality system management, and supply chain management.
1, With 6years working experience of quality management and supply chain management in world top IT500 company.
2, Professional in internal quality standards like ISO, UL and CE; professional in NPI(New Product Introduction) system; professional in quality management and improvement; professional in suppliers audition, improvement and management.
3, Carry out a PC Power Case Appearance Improvement Project, and reduced the appearance defect rate from ≥10000DPMM to ≤1000DPPM.
4, Carry out an Automation Assembly of Mobile Phone Punching Parts project, increased the FPYR(First Pass Yield Rate) from ≤60% to ≥98% within one month, and increased the production efficiency from 600pcs/H to 1000pcs/H.
Name:Tofly  Title:Product Engineer
Responsible for new products prototype and introduction, mass products process control and improvement.
1, More than 10years working experience in electronic product manufacturing FPYT(First Pass Yield Rate) and production efficiency improvement.
2, Professional in IE(Industrial Engineering) and LP(Lean Production) systems.
3, Proficient in AutoCAD and Microsoft Office softwares; master the knowledge of electronic engineering, automatic production control, circuit schematic analysis, and the assembly process of metal & plastic parts and PCBA.
4, Carry out a HP Compaq7 Tablet Improvement Plan, increased the FPYT(First Pass Yield Rate) to ≥93% within one month, and increased the production efficiency from 85pcs/H to 150pcs/H.

We practically eliminate your frustrations and troubles in dealing with multiple suppliers. You can fully rely on our professional team to handle all aspects of your electronic printed circuit projects, so that you can focus on your core business and strength.

Learn About PCB

What is a Printed Circuit Board2014-08-25

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Patterning of Printed Circuit Board2014-08-25

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Chemical Etching2014-08-25

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Inner Layer Manufacturing2014-08-25

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Drilling Process of Printed Circuit Board2014-08-25

Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and d...

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Solder Resist Application of PCB2014-08-25

Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called LPI (liquid photoimageable). A photo sensitive coating is a...

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Exposed Conductor Plating and Coating2014-08-25

PCBs are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper. After PCBs are etched and then rinsed with water, the solder mask is applied, and then...

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Legend Printing of PCB2014-08-25

A legend is often printed on one or both sides of the PCB. It contains the component designators, switch settings, test points and other indications helpful in assembling, testing and servicing the cir...

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Bare-board Test2014-08-25

Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined in a netlist) is verified as correct on the finished board. There are mainly two kinds of electrical t...

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Printed Circuit Board Assembly2014-08-25

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Protection and Packaging of PCB Assembly2014-08-25

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Circuit Properties of the PCB2014-08-25

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Materials of Printed Circuit Board2014-08-25

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Multiwire Boards2014-08-25

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History of Printed Circuit Boards2014-08-25

Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating ...

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